Fabrication and Test of an Induction Motor for the Turbomolecular Pump Using a Ceramic-Insulated Wire.

نویسندگان
چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

development and implementation of an optimized control strategy for induction machine in an electric vehicle

in the area of automotive engineering there is a tendency to more electrification of power train. in this work control of an induction machine for the application of electric vehicle is investigated. through the changing operating point of the machine, adapting the rotor magnetization current seems to be useful to increase the machines efficiency. in the literature there are many approaches wh...

15 صفحه اول

exploring motivation and english test preparation strategies of iranian pre-university candidates during and at the end of test preparation period for konkur examination

the current study aimed at investigating the relationship between motivation and test preparation strategies (tpss) used by iranian pre-university students in their preparation period for the university entrance exam (uee). due to the importance of uee in iran, this study also attempted to show its impact on these two important variables. to this end, 100 pre-university students in an iranian p...

the use of appropriate madm model for ranking the vendors of mci equipments using fuzzy approach

abstract nowadays, the science of decision making has been paid to more attention due to the complexity of the problems of suppliers selection. as known, one of the efficient tools in economic and human resources development is the extension of communication networks in developing countries. so, the proper selection of suppliers of tc equipments is of concern very much. in this study, a ...

15 صفحه اول

Overview of wire bonding using copper wire or insulated wire

Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: SHINKU

سال: 1995

ISSN: 0559-8516,1880-9413

DOI: 10.3131/jvsj.38.291